Add-on inspection options and capabilities

 

2D Metrology: +2CD/+2DM

2D metrology enable accurate two dimensional measurements of individual elements
of a PCB circuit. CIMS offers two types of 2D metrology: +2CD and +2DM.

+2CD: real time micro-measurements of individual PCB elements, such as
traces or pads, with up to ±3 micron accuracy (subject to surface condition).

+2DM: AOI integrated macro-measurements of an entire panel in order to
determine any dimensions violation.
>> read more

                                                                                                                                                                                                                                   

3D Metrology: +3DH/+3DP

3D metrology enable accurate three dimensional measurements of
individual elements of a PCB circuit. CIMS offers two types of 3D metrology:
+3DH and +3DP.

+3DH: real time 3D-measurements of a height or depth of individual PCB
elements achieving up to ±2 micron accuracy (subject to surface condition
of a measured element).

+3DP: real time 3D profiling of individual PCB elements with up to ±1 micron
accuracy (subject to surface condition of a measured element
>> read more

                                                                                                                                                                                                                                 

LDI: Laser Drill Inspection

CIMS LDI is a laser drill inspection option designed for HDI PCB and IC
Substrates. It is supplied as an add-on option suitable for all CIMS Phoenix
family AOI models capable of inspecting laser drills of all sizes (subject to
base system’s resolution).

AOI systems equipped with LDI are capable of scanning both pre- and
post-plating laser vias as well as conformal masks. Each such application
features its own dedicated user interface making a job setup intuitive
and straight forward.
>> read more

                                                                                                                                                                                                                                 

Fi: Final Inspection

Fi (Final Inspection) option allows inspecting of finished boards with
CIMS AOI. It is supplied as an add-on option suitable for all CIMS
Phoenix family AOI models extending their capabilities to final inspection.

Fi can reliably detect common defects on gold, copper and solder mask.

Systems equipped with Fi option feature a dedicated final inspection
interface for parameters setup.
>> read more

                                                                                                                                                                                                                                  

>> AOI Markets

>> IC Substrates: 5 -15 micron nominal line/space

>> HDI PCB: 15 - 30 micron nominal line/space 

>> MLB PCB: 30 - 100 micron nominal line/space

>> Flex, Rigid Flex, R2R: 5 - 15 micron nominal line/space

>> Flex, Rigid Flex, R2R: 15 - 30 micron nominal line/space

>> Special Applications

>> Data Management

>> Technology

All information subject to change without notice!