Planarizing of excess Resin/Paste after the Hole Filling Process is a critical process. Its succes depends on a variety of parameters:

• Type/Brand of Resin
• Resin Bump Height
• Resin Bump hardness
• Copper thickness on the panel surface
• Copper Surface flatness & variation
• Prototype or volume production
• Operator Skills

PCB manufacturers need to carefully consider these variations when chosing the type of Planarization system. It occurs regularly that PCB manufacturers use a combination of different systems for different variaties of filled via's. ADEON Technologies BV offers a range a Planarization systems in partnership with Mass GmbH and Pola & Massa srl.

Mass - SV-200-WV 

Semi-Automatic Planarizing
with Vacuum Table

Pola & Massa - Evo-3000

Automatic Single Brush
Capable of Selective Area filling

Pola & Massa - Pem-650

Multiple Brushes
Higher Volume production

All information subject to change without notice!