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Phoenix Micro

 CIMS 2 2018AOI for IC Substrates with min line/space down to 7 µm.

Phoenix Micro, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates. It is capable to scan down to 7 µm line/space width technology.

The system’s state of the art optical technology Prisma™ is designed to provide flexible light coverage with maximum contrast in order to support high resolution image acquisition at high scanning speed. Optimized performance is achieved by combining sharp high resolution image with customizable detection algorithms.

Equipped with the state-of-the-art image acquisition and advanced software capabilities, the Phoenix product family is renown for its exceptional detection achieved with lowest possible false calls rate.

Phoenix Micro is powered by Spark™ – an innovative cross-platform detection engine.Phoenix Micro 8png

 Basic functionalities include

  • Multi-Step and Multi-Zone for best detection policy set-up per zone
  • Micro Inspection and metrology engine
  • Fully automated set-up
  • Variable continuous resolution defined automatically
  • Cad Analyzer creates best reference for detection
  • Dynamic Job enabling operators to instantly change: • resolution, steps, parameters on the AOI
  • Filtering system – Inspection results can be re-processed on AOI / CVR and present defects immediately after filtering
  • Full automatic (BLACK BOX) Data Processing and Preparation from CAM Station

 System highlights

  • New linear motors for smooth & silent motion
  • Robust structure
  • Automated vacuum table
  • Microlight illumination
  • 64 bit based firmware
  • Powerful processors to handle high density PCB
  • Compatible with front or back L/U automation
  • Simple and quick setting for new jobs

Optional Features

  • +2DM metrology - panel dimensions measurement
  • +2CD metrology - 2D measurments of circuit elements
  • +3DH metrology - 3D measurements of circuit's element height
  • +3DP metrology – 3D profiling of circuit element
  • FI - final inspection for finished bare boards
  • LDI - laser drill inspection
  • CDB/CDBIC - defects classification and virtual defects mapping
  • VVS - virtual verification system

microlight spark

 

 

 

All information subject to change without notice!

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