High Speed - Fine Pitch Flying Probe Test System

Universal shuttle system with clamp and stretch mode for testing flexible and rigid boards. Pneumatic clamping function controlled by foot switch. The test heads of an A8-8 Plus are smaller than of an A7. The system provides therefore more heads per test area than an A7. This means higher speed and throughput. In combination with a special high resolution camera, a glass calibration plate and Micro Probes the system is able to test structures down to a size of 25µm.

 

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KEY FEATURES

• 8 test heads
• High speed direct linear drives voor x and z motion
• Light weight carbon z-axix
• 4 high resolution color cameras
• Fast 300 mA Kelvin testing

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MACHINE FEATURES

MECHANICS

• Max. Panelsize: 640mm x 610mm (25.2" x 24.0")
• Min. Panelsize: 10mm x 10mm (0.4" x 0.4")
• Test area: 610mm x 310mm (24” x 12.2”
• Board thickness: up to 2mm (0.1")
• Smallest Pad size: 25µm (1.0 mil) special setup
• Smallest Pitch: 50µm (2 mil)
• Board thickness*: up to 4mm (0.2")
• Smallest Pad size: 25µm (1.0 mil) Bottom side
• Smallest Pitch: 50µm (2.0 mil) Top side
*Differen board thicknesses on customer request
• 8 Test heads (4 top / 4 bottom)
• 4 high resolution Color Camera's (4 top / 4 bottom) - Resolution 3µm pixel
• Resolution measurement system: ± 0.1µm (± 0.004mil)
• Repeatable accuracy: ± 3µm (± 0.12mil)
• Soft Touch Probes pressure: 5g to 10g 
• Micro Needle Probes pressure: 0.3g to 2.5g 

ELECTRONICS

• Continuity test 1Ω - 10kΩ
• Isolation test
  • Up to 25MΩ (FM)
  • Up to 100GΩ (Ohmic)
  • MicroShort Detection® 
• Test voltage: 100 mV to 1000V 

GENERAL CONNECTIONS

• Data input format: IPC-D-356A
• Network connection: Ethernet, TCP/IP
• Power Supply: 3x400V, 50Hz (3x208V, 60Hz), 1000VA
• Compressed air: 8 bar /115 psi filtered
• Temperature: 18°C to 27°C /66°F to 81°F, ±3K
• Relative humidity: 40% to 60%
• Machine weight: 800kg

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OPTIONS 

• 4-wire Kelvin measurement with max. 300mA test current:
  
  • 0Ω to 1kΩ - Tolerance ± 2%, min. ± 25µΩ
  • with Kelvin probes contact pressure 0.3g to 2g
  • Smallest pad: 50µm (2.0 mil)*
  • Smallest pitch: 100µm (4.0 mil)*
  *with Kelvin probe fine adjustment
• Embedded Component test:
  • R 0Ω - 1MΩ - Tolerance ± 1%, min. ± 0.5Ω | 1MΩ - 200MΩ - Tolerance ± 3%
  • C 0F - 100µF - Tolerance ± 2%, min. ± 30fF
  • L 0H - 10mH - Tolerance ± 5%, min. ± 0.25µH
• Diode/Varistor: U_F,U_R, U_BR 0V to 12.5V 
• LaTest® open detection:
  • With LaTest® probes - 1g to 10g
  • High current - 1.4a (1 Khz)
• Retest of fault files from external grid test systems on inquiry
• Repair software with barcode support 

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All information subject to change without notice!

For more information, visit the website or send us your information request.