Phoenix LV
Phoenix LV is designed to support inspection of laser via
in high volume manufacturing of HDI or IC Substrates.
It is capable to scan via holes down to 30 µm in diameter.
Phoenix MDI
Phoenix MDI is designed for inspection of mechanical
(through) drills and slots on HDI and multi-layer PCB.
It is capable to scan mechanical drills
down to 150 µm in diameter.
Phoenix Touch
Phoenix Touch is designed for inspection of
conductors on touch screen panels. It is capable
to scan down to 25 µm line/space width technology.
Phoenix LT
Phoenix LT is designed for inspection of
large panel of up to 914 mm x 1,067 mm (36″ x 42″).
It is capable to scan down to
40 µm line/space width technology.
>> AOI Markets
>> IC Substrates: 5 -15 micron nominal line/space
>> HDI PCB: 15 - 30 micron nominal line/space
>> MLB PCB: 30 - 100 micron nominal line/space
>> Flex, Rigid Flex, R2R: 5 - 15 micron nominal line/space
>> Flex, Rigid Flex, R2R: 15 - 30 micron nominal line/space
>> Add-Ons
>> Data Management
>> Technology
All information subject to change without notice!