CIMS LDI is a laser drill inspection option designed for HDI PCB and IC Substrates. It is supplied as an add-on option suitable for all CIMS Phoenix family AOI models capable of inspecting laser drills of all sizes (subject to base system’s resolution).

LDI option works with both Microlight™ and Prisma™ illumination technologies utilizing special algorithms and logic optimized for detection of defects that typically occur in laser drills (laser vias). AOI systems equipped with LDI are capable of scanning both pre- and post-plating laser vias as well as conformal masks. Each such application features its own dedicated user interface making a job setup intuitive and straight forward.

LDI option adds a new level of versatility to Phoenix AOI systems enhancing their inspection capabilities to more applications and PCB manufacturing process stages.

Optional Features

• Each 3D option are supplied separate or as a bundle
• Can be bundled with 2D measurement capabilities
• CDB/CDBIC connectivity – defects classification and virtual defects mapping
• Data output options

All information subject to change without notice!