Company Profile

DiS Technology Inc. is an equipment builder that is dedicated to building PC board registration equipment. This is not just the focus of their business; it is their only business. DIS was founded because they saw the direction that the PC board industry was going and recognized the limitations of building multi-layer boards on pins.  

With the goal of designing and building a system that would be more accurate, the first ideas were sketched out and tried. It started by eliminating the mechanical tolerances inherent in pin lamination. Cameras would be used like a post etch punching system however, instead of punching slots, the cores would be sequential clamped in place. The next step was to design a method to keep the cores in alignment during handling and in the lamination press. After reviewing all options, heat bonding was chosen as the best method. The machine was called the PRS-77, which stood for “Pinless Registration System.

Performance

DIS Technology has grown since then and now has an entire family of machines that fit the needs of high volume producers seeking productivity, low volume producers making quick turns and prototypes, and board shops that are somewhere in between. Their second-generation machines feature advanced vision software and lighting that accurately captures targets even when they not perfect. Features have been added that enable mistake proof (poka yoke) construction, rejection of over sized or undersized cores and recording data from each panel built.  

• DIS has designed and patented an innovative weld head design that features two independent inductive weld heads that work together to allow precise control over the weld profile while delivering the power to weld thick panels.
• DIS has translated knowledge and experience in designing and building registration machines to create an innovative pin bonding machine that is easy to use and has industry leading productivity.    
• DIS knows that PC board makers have a variety of choices for their multi-layer registration equipment. So, their mission is to stay ahead of the competition by continuing to innovate and providing industry leading applications support.  
• DIS  has over a decade of experience with difficult multi-layer builds. They  have successfully processed thin cores down to 25uM (1mil), sub-laminations with micro-vias, delicate copper foil layers with holes etched into it, Teflon based materials (Rogers and Taconic), polyamide bond ply, and flex boards. They have processed boards up to 52 layers and have still not reached our limit. They have processed cap construction and foil construction. They have processed mixed construction with thin cores, sub-laminations and copper foil all in one panel. They have successfully welded heavy copper layers (up to 3 ounce, so far) and light copper (down to 1/3ounce) layers.

Support

DIS knows that PC board makers have a variety of choices for their multi-layer registration equipment. So, their mission is to stay ahead of the competition by continuing to innovate and providing industry leading applications support.  

Represented by Adeon in (on UK only for servicing); 

All information subject to change without notice!