R2R Plasma Treatment System
Designed specifically for roll-to-wire circuit board and roll-type materials. The Use of advanced transmission technology; creating the perfect combination for plasma technoloy.
ADVANTAGES
- Moving rectifying system ensures the accuracy of winding
- 40KHz plasma excitation power supply with enhanced arc control and extremely wide matching impedance
- Constant tension and speed control system
- Magnetic sealing technology to ensure the whole plasma process conduct in vacuum
- Patent chamber design ensures the stability of transmission system in vacuum
- Suitable for 3” or 6” roller materials
- Specifically for FPCB surface cleaning and blind hole desmear and cleaning functions
MACHINE FEATURES
- Material width10~500mm
- Material Thickness ≥ 18um
- Material Thickness ≥ 18um
- Processing Seed 0.1-2.0 M/Min
- Reaction Zone Length 4 M
- Capacity of Material 3” or 6”
- Greatest Diameter of Material 350mm
- Accuracy ±1 mm
- Power 40KHz@5KW
- Etching Uniformity ≥80%
- Vacuum Pump Dry Pump 1178CFM
- Working Area 3.5 * 4.5M
- Loading Height 1.2M
- Gas Channels 4 Channels 4 Gases
- Dry Air 80~100PSIG
- Electricity Requirement 208VAC/100A/3PH/50/60HZ
- Tension Control Range 0N~100N (Can be configured)
- Weight of Machine 4700KG
OPTIONS
- H2 Processing Integrated Safety Control & dedicated Mass Flow Controllers
RELATED PRODUCTS
All information subject to change without notice!
For more information, visit the website or send us your information request.