High-volume manufacturing of High Density Interconnect (HDI) PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. MKS-ESI’s HDI systems enable HDI manufacturers to drill vias
in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials.
Advantages of MKS-ESI’s HDI solutions are ESI’s expertise in laser processing, great reliability at high quality output, lowest cost of ownership and professional sevice and support througout the world.
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