Products Overview
Laser Drilling Solutions
PCB Flex Laser Via Drilling
As a part of MKS-ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning.
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Capstone
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PCB Flex Laser Via Drilling
Utilizing MKS-ESI’s Third Dynamics™ technology, the 5335™ delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards.
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5335
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PCB Flex Laser Via Drilling
RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as MKS-ESI’s other flex drilling systems, RedStone™ offers an ideal entry point for customers new to flex drilling.
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PCB Flex Laser Via Drilling
The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat-affected zones, delivering exceptional accuracy and tight tolerances required by processors.
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LodeStone
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High Density Interconnect
High-volume manufacturing of High Density Interconnect (HDI) PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale.
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Geode
Laser via drilling system for flex PCB processing
MKS-ESI’s Geode™ is a laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB). The Geode™ combines a CO2 laser and advanced beam control capabilities to deliver greatest throughput and accuracy from a system that is significantly smaller and lighter than current competitive offerings. The system’s sophisticated beam steering and pulse shaping technologies provide the flexibility and control that will be required for 5G applications using high-frequency compatible materials and finer-pitched interconnects fabricated with modified semi-additive processes (mSAP).
The Geode™ system uses a powerful 9.4µm pulsed CO2 laser, emitting infrared radiation ideally-suited for rigid PCB materials. Its HyperSonix™ technology shapes laser pulses to improve throughput and via quality. AcceleDrill™ distributes pulse energy to improve throughput and via metrics and also permits multiple via sizes in a single pass. VDC (via density compensation) controls local heating to minimize heat-affected zones and improve accuracy, throughput and diameter stability. The Geode™ system is the first CO2 laser via drilling system to incorporate such high level beam control and beam steering technologies.
SPECIFICATIONS
| LASER | MATERIAL HANDLING |
| Via Diameter Range: 35-200um | Panel Size Range: 16”x20” to 22”x24” |
| Panel processing: Dual-head two panel system | Panel Thickness Range: 40um - 2000um |
| Throughput: Up to 9500 pps | |
| Peak Power: 2.5kW | |
| Laser Pulse Frequency: Up to 6.5kHz | |
| Average Power: >This email address is being protected from spambots. You need JavaScript enabled to view it. | |
| Processing: CDD/Large Window/Conformal Mask/LTH | |
| Scan Area: 20x20mm (Third DynamicsTM beam positioning technology) | |
| Scan Frequency (per head): 5200 points per second (500um pitch) | |
| Total System Accuracy: +/- 8um mean +4Σ | |
| Energy Monitoring: Real time pulse energy monitoring (programmable alarm settings) | |
| Panel Height Detection: Touchdown sensor (calibrated to align with camera focus) | |
| Automation Panel Autoloader: std, NG panel, Flipping | |
| Automation Accuracy (panel to chuck): 500um/LTH |
SUMMERY
| MARKETS | APPLICATIONS | MATERIALS |
| Automotive | PCB Manufacuring | FR4 |
| Aerospace | Integrated Circuit Packaging | BT |
| Medical | Substrate Processing | ABF |
| System Level Packaging | PTFE | |
| EMC | ||
| RCC | ||
| LCP | ||
| Ceramics | ||
| Glass |
FEATURES & OPTIONS
- HyperSonix™ Sound waves shape laser pulses to improve via quality and increase throughput
- VDC™ Via density compensation improves via diameter stability, accuracy and throughput
- LiteDesign™ Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor
- AcceleDrill™ Uses sound waves to distribute light to drill different vias without optics path adjustments (no downtime)
- AeroCore™ Integrated structural air flow supports improved thermal equilibrium and simplified maintenance
- UpTime™ Easy-access design improves serviceability, decreasing maintenance and service downtime
All information subjected to change without notice!
For more information, visit the website or send us your information request.
Rollmaster
High-volume manufacturing with flex PCB materials
RollMaster™ enables flex PCB manufacturers to process a wide range of materials while maintaining high throughput. The patent-pending Dynamic Tensioning™ technology used in the RollMaster™ handlers continuously adjusts for the changes in bi-directional tension placed on flex material as the result of acceleration and deceleration of the material during processing. RollMaster™ is a high-throughput solution for processors utilizing a variety of web widths and different materials, especially those prone to wrinkling or stretching.
SPECIFICATIONS - MATERIAL HANDLING
- Web width: 150-520mm
- Edge guidance: 100μm accuracy
- Feed rate: 1.5G acceleration
- Maximum index distance: 635mm
- Spindle diameter: Interchangeable 75 & 150mm
SUMMERY
| MARKETS | APPLICATIONS | ROLLED FLEX MATERIAL WITH |
| Flex PCB Laser Processing | Web handling compatible with ESI’s flexible circuit laser drilling tools | Web widths between 150-520mm |
| Roll weight up to 70kg | Roll outer diameter up to 400mm | |
| Films and laminates as thin as 12um and below | ||
| lms and laminates as thin as 12um and below |
RELATED PRODUCTS
All information subjected to change without notice!
For more information, visit the website or send us your information request.
Lodestone
Efficient laser cutting of flexible circuits & specialized materials
The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat-affected zones, delivering exceptional accuracy and tight tolerances required by processors.
Inefficient energy absorption is a major cause of poor quality and low throughput in many materials. Ultra-short-pulse lasers can avoid issues associated with poor laser energy absorption due to its cold ablation mechanism. LodeStone™ uses an ESI-designed femtosecond laser with proprietary fiber technology that enables you to process a broader range of material with high quality and productivity.
SPECIFICATIONS
| LASER | MATERIAL HANDLING |
| Femtosecond Green – 12W | Vacuum chuck - 533mm x 635mm (±20um accuracy) |
| Electrical and software interface for web and panel handler integration |
SUMMERY
| MARKETS | APPLICATIONS | MATERIALS |
| Flex PCB Laser Processing | Flex and interconnect processing | Polyimide (PI) |
| Rigid-Flex Laser Processing | FPC depaneling | Liquid Crystal Polymer (LCP) |
| Laser Micromachining | Coverlay routing | Cyclo-Olefin Polymer (COP) |
| Display and touch panel processing | Touchscreen and polarizer cutting | Polyethylene terephthalate (PET) |
| Through via drilling (THV) | Adhesiveless copper-clad polyimide laminates | |
| Copper-clad polyimide laminates with adhesive | ||
| Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid) | ||
| Coverlay (Polyimide + Adhesive) |
FEATURES & OPTIONS
- ESI-patented compound beam positioning technology
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 7 interface
- Multi-language operator user inferface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
RELATED PRODUCTS
All information subjected to change without notice!
For more information, visit the website or send us your information request.