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Products Overview

RFS 100

DIS Web

Precise Visual Lay-Up, Alignment & Bonding of Multilayers

 

 

The RFS -100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs  and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

RFS 100 

 
 

  

 

 

 

 

FEATURES

  • Optically align and bond Rigid, Flex and Rigid-flex boards
  • The system will process all panel sizes from 305 x 355mm to 610 x 760mm (12” x 14” to 24” x 30” )
  • Simple touch screen controls
  • Ideal for prototype, small volume and high mix production

All information subjected to change without notice!

For more information, visit the website or send us your information request.