The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together. Three different processes take place in one unit; lay-up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination or rivet deformation.
The system may be used to weld a miltilayer, as in conventional laminanation or to align and weld two or more multilayer subassemblies. The SmartWeld Technology allows the user to have complete and independent control of the heating and cooling times as well as bonding pressure.
All information subjected to change without notice!
For more information, visit the website or send us your information request.
The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together. Three different processes take place in one unit; lay-up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination or rivet deformation.
The system may be used to weld a miltilayer, as in conventional laminanation or to align and weld two or more multilayer subassemblies. The SmartWeld Technology allows the user to have complete and independent control of the heating and cooling times as well as bonding pressure.
All information subjected to change without notice!
For more information, visit the website or send us your information request.
The PRS Shuttle advanced Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.
All information subjected to change without notice!
For more information, visit the website or send us your information request.