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S3

atg lm logo web 278x300 

High End Substrate Flying Probe Test System

Atg Luther & Maelzer launched the S3, which is able to test 10µm structures while achieving 100 measurements per second. The machine therefore provides the customer with an economical test solution for high end substrates. The S3 provides the highest accuracy with the best performance to test the latest technology of substrate boards. The S3 has a granite frame, which gives the best temperature stability. The high resolution cameras of 1.2 µm per pixel provide the functionality to automatically scan and test 10 µm structures reliably.

 


KEY FEATURES

  • Highest accuracy to test state-of-the-art substrate products
  • 4 test heads and single sided test against vacuum plate
  • 10 µm pad size and 25 µm pitch
  • Max. product size 300mm x 310mm (11.8″ x 12.2″)
  • Cameras with 1.2 µm Resolution per pixel

MACHINE FEATURES


MECHANICS

  • s3Max. Panelsize: 330mm x 310mm (13" x 12.2")
  • Test area: 300mm x 310mm (11.8" x 12.2")
  • Board thickness: 0.05mm to 3mm
  • 8 Test heads (4 top / 4 bottom)
  • 1 high resolution color camarea for optical scaning op top side
  • Resolution 1.2µm pixel
  • Smallest Pad: 10µm / 0.4mil * (special setup)
  • Smallest Pitch: 25µm / 1.0 mil
  • Resolution measurement system: ± 0.1µm (± 0.004 mil)
  • Repeatable accuracy: ± 1.5µm (± 0.06 mil)
  • Micro needle probes: 0.3g to 2.5g
  • Soft landing

ELECTRONICS

  • Continuity test: 1Ω - 10 kΩ
  • Isolation test:
    • Up to 25MΩ (FM) 
    • Up to 10GΩ (Ohmic)
    • MicroShort Detection®
  • Test voltage: 100mV up to 1000V

GENERAL CONNECTIONS

  • Data input format: IPC-D-356A
  • Network connection: Ethernet, TCP/IP
  • Power Supply: 3x 400V, 50Hz (3x 208V, 60Hz), 500VA
  • Compressed air: 8 bar/115psi filtered
  • Temperature: 18°C to 24°C
  • Relative humidity: 40% to 60%
  • Machine weight: 900kg

OPTIONS 

  • 4-wire Kelvin measurement with max. 300mA test current:
    • 0Ω to1kΩ - Tolerance ± 2%, min. ± 25µΩ
    • With FP Kelvin probes contact pressure 0.3g to 2g
    • Smallest pad: 30µm ( 1.2 mil)*
    • Smallest pitch: 80µm ( 3.2 mil)*
    • *with Kelvin probe fine adjustment
  • Embedded Component test:
    •  R 0Ω - 1MΩ - Tolerance ± 1%, min. ± 0.5Ω | 1MΩ - 200MΩ - Tolerance ± 3 % 
    • C 0F 100µF - Tolerance ± 2%, min. ± 30fF
    • L 0H to 10mH - Tolerance ± 5%, min. ± 0.25µH
  • Diode/Varistor:
    • Diode Varistor UF,UR, UBR 100mV to 12.5V
    • Structural test of integrated circuits: opens/shorts test on CMOS devices with ESD diodes
  • Multi-Point Measurements:
    • Up to three AC/DC sources (voltages and current) simultaneously
    • Transistors (MOSFET and Bipolar), Optocouplers, Fuses, Relays, Transformers, etc. 
    • Imax=300mA
  • Repair software with barcode support 

RELATED PRODUCTS 

S2-16 S2-16    s3-8  

 

 

 


All information subject to change without notice!

For more information, visit the website or send us your information request.