High Volume, Fast Processing

• 15 Cells
• Cell Size: 1118 * 610mm (44 * 24")
• Multiple Panel loading per Cell

Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.

P15V-M PLASMA TREATMENT SYSTEM 

• The P15V-M system platform is completely self-contained, requiring minimal floor space. The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal. No side access is required allowing for even greater floor space savings.
• The P15V-M system incorporates the best of Boffotto's market leading technology combined with novel application specific technology development based on our greater than 20 years of experience. Through extensive research and development, the P15V-M system presents unique vacuum and gas flow technology, new electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters delivers a system that creates the most uniform PCB treatment for key applications like desmear and landing pad cleaning.
• All our P15V system's superior performance capabilities are complemented by very attractive low-cost-of-ownership aspects. The system features a very compact and service-friendly design. The vertical loading concept and the use of easy loading carts minimizes any idle time which generates high levels of productivity. The fast vacuum pump down and greatly enhanced process cycle times further add to the throughput and productivity of the system.
• Equipped with a touch-screen PC Operator Interface, the P15V-M system provides a wide breadth of control capability and data collection. Unlimited recipes can be stored for easy switching of plasma processes from batch to batch. Password protection ensures that no unauthorized entries can be made.

ADVANTAGES 

• High throughput of HDI, flexible and rigid panels for maximum production flexibility
• Accommodates larger panel sizes within a small footprint to consume minimal floor space
• Faster units per hour (UPH) processing to meet today's demanding manufacturing schedules
• Low CF4 gas consumption for desmear applications contributes to the lowest cost of ownership in its class
• Patented system technologies produce superior process uniformity at high throughputs

MACHINE FEATURES 

• Aluminium Chamber Construction
• Vacuum Chamber: 1680L
• Real-Time Temperature Controlled Electrodes
• Oxygen Service DRY Pumping Package with 65 CFM Pump and 2600CFM Blower
• PE II - 10,000 Watt, 40 KHz RF generator with automated tuning network
• Gas Control of up to 5 Mass Flow Controllers with low gas alarms
• Optimized gas consumption for cost-effective use of gasses such as CF4
• Multiple Rack Assemblies for optimized loading of Rigid and Flex Panels
• Fully Integrated High Resolution Touch Screen
• No hazardous waste disposal  

OPTIONS

• H2 Processing Integrated Safety Control & dedicated Mass Flow Controllers
• Wide Range of Frames available for easy and secure Flex Panel loading & processing 

RELATED PRODUCTS 

       

All information subject to change without notice!

For more information, visit the website or send us your information request.

Adeon Technologies offers a complete range of Boffotto Plasma Systems for Printed Circuit Board processing.

As European market leaders in the field of plasma we understand the need for flexibility and versatility. The keywords for plasma batch processing  of Printed Circuit Boards are "Process Uniformity". Adeon offers to all Plasma systems it supplies a free of charge "Life Long Application Support", meaning we will provide the best possible recepies and parameters for the Plasma Batch Process based on materials loaded and process type required as for example:

• Desmear & Etchback
  Improving reliability. Plasma effectively removes the residual resin and other contaminants in multi-layer printed circuit boards to vastly improve reliability.
  The mechanical drilling of vias in multi-layer PCBs creates a residual resin that smears along the walls of the vias, impeding metalization of the electrical connections. After drilling, resin removal from inner layer posts is required to ensure reliable electrical contact. Traditional methods of etching and desmearing are often not effective for today’s multi-layer board designs due to the capillary effect present with wet chemicals, and the limitations related to the use of advanced board materials. In contrast, plasma effectively removes epoxies, polyimides, high Tg blends, mixed materials, and other resins in standard and high aspect ratio panels.
• Surface Activation
  Inner layer preparation: Plasma alters the topography and wettabilitty of inner printed circuit board layers to promote adhesion Cover-coated inner board layers that contain flex materials with unsupported polyimides have smooth surfaces that are difficult to laminate. Plasma alters the topography and wettability of the inner layers to promote adhesion by allowing thin layer processing through use of flex clips. Other chemical processes are not as effective: it is difficult to control the amount of material removed, and unsupported polyimides are inert to most chemicals.
• Carbon removal
  Plasma treatment removes carbon from both conventional through-hole board vias and blind vias. Laser-formed vias often produce a carbon by-product that prohibits electro-less adhesion. Carbon that mixes with epoxy or polyimide resin and becomes trapped in the vias must be removed prior to metalization. Plasma cleaning removes the carbon from both conventional through-hole board vias and blind vias typically used on boards where component space is restricted.
• Cleaning Descum
  Plasma treatment removes resist residue from PCB inner layers and panels without affecting the circuit pattern. It also removes residual solder mask bleed from lands for better bonding and solderability. Resist residue sometimes remains after developing fine pitch circuitry. If the residue is not removed prior to etch, the board can short circuit. Plasma effectively removes resist residue from inner layers and panels without affecting the circuit pattern. It also removes residual solder mask bleed from lands for better bonding and solderability.
• Surface - PTFE Activation
  The Boffotto plasma process can modify fluoropolymer surfaces and desmear resins to prepare hole walls for electro-less copper or direct metalization
  Surface activation for double-sided and multi-layer fluoropolymer through-hole boards is necessary to increase surface wettability. Chemical processes do not have the flexibility to treat non-stick materials and other resins mixed in the same panel. However, a single plasma process can modify fluoropolymer surfaces and desmear resins, effectively preparing hole walls for electro-less copper or direct metalization.

All information subject to change without notice!

For more information, visit the website or send us your information request.

 Low to Mid Volume, Fast Processing

• 9 Cells
• Cell Size: 1118 * 610mm (44 * 24")
• Multiple Panel loading per Cell
• Upgradeable to 15 Cells

Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.

  P15V-M PLASMA TREATMENT SYSTEM 

• The P15V-E9 system platform is completely self-contained, requiring minimal floor space. The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal. No side access is required allowing for even greater floor space savings.
• The P15V-E9 system incorporates the best of Boffotto's market leading technology combined with novel application specific technology development based on our greater than 20 years of experience. Through extensive research and development, the P15V-E9 system presents unique vacuum and gas flow technology, new electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters delivers a system that creates the most uniform PCB treatment for key applications like desmear and landing pad cleaning.
• All our P15V system's superior performance capabilities are complemented by very attractive low-cost-of-ownership aspects. The system features a very compact and service-friendly design. The vertical loading concept and the use of easy loading carts minimizes any idle time which generates high levels of productivity. The fast vacuum pump down and greatly enhanced process cycle times further add to the throughput and productivity of the system.
• Equipped with a touch-screen PC Operator Interface, the P15V-E9 system provides a wide breadth of control capability and data collection. Unlimited recipes can be stored for easy switching of plasma processes from batch to batch. Password protection ensures that no unauthorized entries can be made.

ADVANTAGES 

• Accommodates larger panel sizes within a small footprint to consume minimal floor space
• Faster units per hour (UPH) processing to meet today's demanding manufacturing schedules
• Low CF4 gas consumption for desmear applications contributes to the lowest cost of ownership in its class
• Patented system technologies produce superior process uniformity at high throughputs

MACHINE FEATURES 

• Aluminium Chamber Construction
• Vacuum Chamber: 1680L
• Real-Time Temperature Controlled Electrodes
• Oxygen Service DRY Pumping Package with 65 CFM Pump and 2600CFM Blower
• PE II - 10,000 Watt, 40 KHz RF generator with automated tuning network
• Gas Control of up to 5 Mass Flow Controllers with low gas alarms
• Optimized gas consumption for cost-effective use of gasses such as CF4
• Multiple Rack Assemblies for optimized loading of Rigid and Flex Panels
• Fully Integrated High Resolution Touch Screen
• No hazardous waste disposal

OPTIONS

• H2 Processing Integrated Safety Control & dedicated Mass Flow Controllers
• Wide Range of Frames available for easy and secure Flex Panel loading & processing 

RELATED PRODUCTS 

       

All information subject to change without notice!

For more information, visit the website or send us your information request.