3D metrology is CIMS technology for accurate three dimensional measurements of individual elements of a PCB circuit. 3D metrology options can also be integrated with selected CIMS AOI systems providing a live control loop for the purposes of quality assurance.

CIMS offers two types of 3D metrology:

+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2 micron accuracy (subject to surface condition of a measured element). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+3DP: real time 3D profiling of individual PCB elements with up to ±1 micron accuracy (subject to surface condition of a measured element). This option is commonly used for measuring depth of dimples resulting from plating over laser vias. +3DP allows users to detect quality problems related to a specific process and provide data necessary for corrective action.

Highlights

• Integration with CIMS AOI systems
• Eliminates external measurement process
• Fast and reliable
• Provides immediate feedback and live alerts
• Data collection and output option
• Pre-programmed offline

Optional Features

• Each 3D option are supplied separate or as a bundle
• Can be bundled with 2D measurement capabilities
• CDB/CDBIC connectivity – defects classification and virtual defects mapping
• Data output options

All information subject to change without notice!