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- IC Substrates: 4 - 15 micron nominal line/space
- HDI PCB: 15 - 30 micron nominal line/space
- MLB PCB:30 - 100 mu nominal line/space
- Flex, Rigid Flex, R2R: 5-15mu nominal line/space
- Flex, Rigid Flex, R2R: 15-30mu nominal line/space
- Galaxy: 15 - 30 micron nominal line/space
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- Multilayer Bonding
- Plasma Systems
- Registration Process Control
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- Surface Treatment
- Wet Process Equipment
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Products Overview
- Home
- Products
- AOI Systems
- AOI Markets
- IC Substrates: 4 - 15 micron nominal line/space
- HDI PCB: 15 - 30 micron nominal line/space
- MLB PCB:30 - 100 mu nominal line/space
- Flex, Rigid Flex, R2R: 5-15mu nominal line/space
- Flex, Rigid Flex, R2R: 15-30mu nominal line/space
- Galaxy: 15 - 30 micron nominal line/space
- Special Applications
- Add-ons
- Data Management
- Technology
- Board Handling Systems
- CAM Software
- Contact Cleaning
- Drillroom Equipment
- Electrical Testing
- Hole Filling & Planarizing
- Imaging Systems
- Inkjet Printing
- Multilayer Bonding
- Plasma Systems
- Registration Process Control
- Solder Resist Equipment
- Surface Treatment
- Wet Process Equipment
- X-Ray Systems
- AOI Systems
- Partners
- News & Events
- About Us
- Vacancies