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Products Overview

VCP-5000-1

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The world's favorite choice for Double Sided Vacuum Filling of (via) Holes

This machine is designed for filling holes in printed circuit boards with conductive or non-conductive paste. Both through-holes and blind via-holes allow to be filled. Blind via-holes allow to be plugged double-sided in one cycle. Two filling heads are included in the scope of supply. For inspection purposes the vacuum chamber can be viewed from both sides.

 

The Filling Process:mass vcp5000

  • Once the printed circuit board in vertical position has been hanged upon pins, the door is closed and the vacuum process started. The vacuum has built up after about 15 seconds. The filling process begins with the paste by piston being pressed out of a cartridge into the bores whilst the squeegee being moved over the printed circuit board. Both the kiss pressure of the filling heads to the printed circuit board and filling pressure are adjustable. The vertical motion is realized by an adjustable servomotor.

  • If there are still some hole voids, the operator can re-plug the same printed circuit board. That’s the great advantage when “plugging under vacuum”.

  • The door is fitted with a safety light curtain.

  • The paste is kept in refillable cartridges.

  • Subject to the printed circuit format, different squeegee sizes are available.

  • The machine is already designed for a large container system (LCS). The storage tank with paste is located outside the machine. A high-pressure valve for exact dosing is within the machine.

ES Automatic Scavenger System:

  • This machine is designed for doctoring excess plugging paste from the surface of the printed circuit board. For doing so, the plugged panel is placed into the Automatic Scavenger System after which the automatic process of squeegee blades wiping off the excess paste material on both sides of the panel is conducted.
  • Depending on the chosen Squeegee Blade pressure the excess Paste will be typically reduced by 20 to 6 micron (0.8 to 2.0 mil)

Filling and Scavenging Section

VCP 5000 plus










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Micro section

Capabilities:

  • Hole diameters:
    - Minimum mechanical drilling 80µm for laser drilling
      (Holes must be in a range of +/- 50µm) 
    - Maximum mechanical drilling 0.1mm after plating

  • Active area:
    - starts with 15mm from panel edges
    - bottom end-position is definable

  • Job Set up time:
    - typical <2 minutes
    - Off line Recepy management possible

  •  Paste residue:
    - after hole filling approx. 6 – 20 µm
    - after scavenging approx. 3 – 6 µm

Technical data:

  • System dimensions: (W*D*H): 2475mm * 630mm * 2072mm (97.45" * 24.8" * 81.6")
  • Weight: approx. 950kg / 2100lbs
  • Panel thickness standard: 0,5 - 7,5mm (0,02" - 0,30")
  • Panel thickness optional: 0,2 - 0,8mm (0,007" - 0,03") with additional special set (2)of Filling Heads
  • Panel lengths from - to: 400 - 762mm (15.7" - 30")
  • Panel widths from - to: 200 - 620mm (7.8" - 24.4")
  • Compressed air: 90 PSI / 6 bar
  • Electricity: 400V, 3P, N, PE, 50Hz 5kW (480V, 3P,PE, 60Hz 5kW)

Options:

All information subject to change without notice!