Ucamco NV has partnered with Dainippon Screen to introduce Ledia 5, Screen's revolutionary Direct Imaging machine to the European market.
Already more than 40 systems installaed worlwide. After the first system entered Europe to the
company Richter Elektronik GmbH in Germany, now ACB NV in Belgium as a leading european PCB
manufacturer will also see the Ledia 5S installed in October 2013.
Ledia 5 offers unparalleled benefits over traditional laser direct imaging.
Uses a UV-LED light source with broad wavelength spectrum resulting in:
- Optimal imaging of a wide range of solder mask and resist film type
- Optimal curing over the whole depth of the solder mask and resist film
- Imaging of conventional solder mask film with high throughput
- Imaging of conventional resist film with high throughput
- Low operational cost
- Up to 5 times faster than current systems
- Has 5 or 6 heads to expose a panel width of up to respectively 540 mm or 610 mm
- Is a manual system which can be automated with your own choice of automation
For more information, go to the Ledia page.