Large Format Flying Probe Test System 

This new flying probe system is equipped with between 16 and 24 test heads, up to 12 cameras for optical alignment and the latest motion system design with direct linear drive technology for highest accuracy and test speed even on large Format. Universal shuttle system with clamp and stretch mode for testing flexible and rigid boards. Pneumatic clamping function controlled by foot switch.

The A7-16 is designed for large server and back panel applications for the telecommunication industry. This kind of test products have up to 72 layers with a product weight of up to 30 kg (66 lbs). 100.000 test points are very common on formats of up to 1.5 m (60 inches). In combination with higher density electrical test becomes challenging. Traditional test solutions such as four-head probe systems or multiple oversized test fixtures for grid systems cannot fully meet the requirements in terms of speed and cost.

The system is designed to fully support ease-of-operation and best operator/machine ratio. The horizontal test position provides the advantage that one operator is able to load and unload heavy printed circuit boards. An optional moveable support table, which can be attached to the front of the test system, is available for loading and unloading.

KEY FEATURES

• High speed high throughput test system for backpanel and server boards
• 16 test heads
• Test area 24" x 39,6" (610mm x 1000mm)
• Tension option for flexible boards
• Also available with 20 or 24 test heads for board sizes up to 27" x 59,2" (670mm x 1500mm)

MACHINE FEATURES

MECHANICS

• Max. Panelsize: 640mm x 1050mm (25.2" x 41.4")
• Min. Panelsize: 50mm x 50mm (2.0" x 2.0")
• Test area: 610mm x 1000mm (24” x 39.4”)
• Also available with 20 or 24 test heads for board sizes up to 27" x 59.2″ (670mm x 1500mm)
• Tension option for flexible boards
• Board thickness: up to 10mm (0.4")
• 16 Test heads (8 top / 8 bottom)
• 8 XGA Color Camera's (4 top / 4 bottom)
• Smallest Pad size: 50µm (2.0 mil with Softouch Probes)
• Smallest Pitch: 100µm (4.0 mil)
• Resolution measurement system: ± 0.1µm (± 0.004mil)
• Repeatable accuracy: ± 4µm (± 0.16mil)
• Soft Touch Probes pressure: 5g to 10g

ELECTRONICS

• Continuity test 1Ω - 10kΩ
• Isolation test:
  • Up to 25MΩ (FM)
  • Up to 10GΩ (Ohmic)
  • MicroShort Detection® 
• Test voltage: 100mV to 1000V 

GENERAL CONNECTIONS

• Data input format: IPC-D-356A
• Network connection: Ethernet, TCP/IP
• Power Supply: 230V, 50Hz (115V, 60Hz), 1500VA
• Compressed air: 8 bar /115 psi filtered
• Temperature: 18°C to 27°C /66°F to 81°F, ±3K
• Relative humidity: 40% to 60%
• Machine weight: 1200kg

OPTIONS 

• 4-wire Kelvin measurement with max. 300mA test current:
  
  • 0Ω to 1kΩ - Tolerance ± 2%, min. ± 25µΩ
  • With Kelvin probes contact pressure 0.3g to 2.5g
  • Smallest pad: 80µm (3.2 mil)*
  • Smallest pitch: 120µm (4.8 mil)*
  *with Kelvin probe fine adjustment
• Embedded Component test:
  • R 0Ω - 1MΩ - Tolerance ± 1%, min. ± 0.5Ω | 1MΩ - 200MΩ - Tolerance ± 3%
  • C 0F 100µF - Tolerance ± 2%, min. ± 30fF
  • L 0H to 10mH - Tolerance ± 5%, min. ± 0.25µH
• Diode/Varistor: U_F,U_R, U_BR 0V to 12.5V 
• LaTest® open detection:
  • With LaTest® probes - 1g to 10g
  • High current - 1.4a (1 Khz)
• Retest of fault files from external grid test systems on inquiry
• Repair software with barcode support 

RELATED PRODUCTS 

         

All information subject to change without notice!

For more information, visit the website or send us your information request.

System for HDI and substrate products  

The S-line is characterized by an outstanding test head technology. Linear motor drives in combination with ceramic air bearing gives the S2-8 plus and S2-16 plus the highest speed and accuracy. The testers are equipped with a dual shuttle system. One shuttle can be unload and load while the board in the second shuttle is tested, maximizing machine utilization.

KEY FEATURES

• Double shuttle system for fast loading and unloading of boards
• System for HDI and substrate products
• 15 µm pad size and 35 µm pitch
• 16 test heads
• Max. test area 610 mm x 620 mm (24.0″ x 24.4″)
• Cameras with 3 µm resolution per pixel

RELATED PRODUCTS 

      

All information subject to change without notice!

For more information, visit the website or send us your information request.

System for HDI and substrate products  

The S-line is characterized by an outstanding test head technology. Linear motor drives in combination with ceramic air bearing gives the S2-8 plus and S2-16 plus the highest speed and accuracy. The testers are equipped with a dual shuttle system. One shuttle can be unload and load while the board in the second shuttle is tested, maximizing machine utilization.

KEY FEATURES

• Double shuttle system for fast loading and unloading of boards
• System for HDI and substrate products
• 15 µm pad size and 30 µm pitch8 test heads
• Max. test area 610mm x 310mm (24.0″ x 12.2″)
• 8 test heads
• Cameras with 3 µm resolution per pixel

MACHINE FEATURES

MECHANICS

• Max. Panelsize: 610mm x 330mm (24" x 13.0")
• Min Panelsize: 10mm x 10mm (0.4" x 0.4")
• Test area: 61mm0 x 310mm (24" x 12.2" )
• Board thickness: up to 2mm (0.32")
• 8 Test heads (4 top / 4 bottom)
• 4 Camera's (2 top / 2 bottom)
• Smallest Pad: 15µm * special setup
• Smallest Pitch: 30µm (1.2 mil)
• Resolution measurement system: ± 0.1µm (± 0.004 mil)
• Repeatable accuracy: ± 2µm (± 0.8 mil)
• Soft Touch Probes pressure: 5g to 10g
• Micro Needles Probes pressure: 0.3g to 2.5g

ELECTRONICS

• Continuity test: 1Ω - 10kΩ
• Isolation test:
  • Up to 25MΩ (FM) 
  • Up to 10GΩ (Ohmic)
  • MicroShort Detection®
• Test voltage: 100mV to 1000V
  
  

GENERAL CONNECTIONS

• Data input format: IPC-D-356A
• Network connection: Ethernet, TCP/IP
• Power Supply: 3x 400V, 50Hz (3x 208V, 60Hz), 1200VA
• Compressed air: 8 bar/115psi filtered
• Temperature: 18°C to 24°C
• Relative humidity: 40% to 60%
• Machine weight: 1550kg

OPTIONS 

• 4-wire Kelvin measurement with max. 300mA test current:
  
  • 0Ω to 1kΩ - Tolerance ± 2%, min. ± 25µΩ
  • with Kelvin probes contact pressure 0.3g to 2g
  • Smallest pad: 40µm (1.6 mil)*
  • Smallest pitch: 80µm ( 3.2 mil)*
  *with Kelvin probe fine adjustment
• Embedded Component test:
  •  R 0Ω - 1MΩ - Tolerance ± 1%, min. ± 0.5Ω | 1MΩ - 200MΩ - Tolerance ± 3% 
  • C 0F 100µF - Tolerance ± 2%, min. ± 30fF
  • L 0H to 10mH - Tolerance ± 5%, min. ± 0.25µH
• Diode/Varistor: U_F,U_R, U_BR 0V to 12.5V 
• Pneumatic clamping with supporting table for flexible boards
• Retest of faultfiles from external grid test systems on inquiry
• Repair software with barcode support

RELATED PRODUCTS 

      

All information subject to change without notice!

For more information, visit the website or send us your information request.

Fully Automated Optical Fixture Alignment System 

The optical alignment system measures the offset between board image top / bottom and the mechanical drilled through-holes. An adjustment frame can move the fixture up to +/- 200 µm against the board layout.

KEY FEATURES

• Fully automated detection of PCB manufacturing tolerances
• Compatible with LM400 and LM800 grid test systems
• 2 telecentric lenses with high resolution cameras

MACHINE FEATURES

• Max. Panelsize: 300mm x 300mm (11.81" x 11.81")
• Two color Firewire cameras with 5 Mpx
• Compatible with Luther & Maelzer LM400 and LM800 test systems
• Plain image capturing software on Windows PC
• Axial LED lighting
• Double-sided optical survey
• Test system controlled
• Manual width adjustment of conveyor belt
• Manual alignment of telecentric lenses in x- and y-direction
• PCB offset alignment by fixture feedback frame in test unit

TECHNICAL DATA

• Camera monitoring area: 91mm x 76 mm
• Camera resolution: 2448px x 2048px (37 µm/px)
• Repeatability ± 10 µm
• Power supply 230 V / 50 Hz (115 V / 60 Hz), 500 VA
• Weight 320kg / 705lbs

RELATED PRODUCTS 

      

All information subject to change without notice!

For more information, visit the website or send us your information request.