AOI for inspection of touch screen panels down to 25 µm line/space width.

Phoenix Touch, CIMS latest generation of AOI system, is designed for inspection of conductors on touch screen panels. It is capable to scan down to 25 µm line/space width technology.

The system’s state of the art optical technology Microlight™ is specifically designed and calibrated to achieve optimal image acquisition of laser drills both before and after plating as well as conformal mask applications. Optimized performance is achieved by combining superior image quality with customizable detection algorithms.

Equipped with the state-of-the-art image acquisition and advanced software capabilities, the Phoenix product family is renown for its exceptional detection achieved with lowest possible false calls rate.

Phoenix Touch is powered by Spark™ – an innovative cross-platform detection engine.

Basic functionalities include

• Multi-Step and Multi-Zone for best detection policy set-up per zone
• Micro Inspection and metrology engine
• Fully automated set-up
• Variable continuous resolution defined automatically
• Cad Analyzer creates best reference for detection
• Dynamic Job enabling operators to instantly change:
  • resolution, steps, parameters on the AOI
• Filtering system – Inspection results can be re-processed on AOI / CVR and present defects immediately after filtering
• Full automatic (BLACK BOX) Data Processing and Preparation from CAM Station

 System highlights

• New linear motors for smooth & silent motion
• Robust structure
• Automated vacuum table
• Microlight illumination
• 64 bit based firmware
• Powerful processors to handle high density PCB
• Compatible with front or back L/U automation
• Simple and quick setting for new jobs

Optional Features

• +2DM metrology - panel dimensions measurement
• +2CD metrology - 2D measurments of circuit elements
• CDB/CDBIC - defects classification and virtual defects mapping
• VVS - virtual verification system

All information subject to change without notice!

2D metrology is CIMS technology for accurate measurements taken on the surface of a PCB. 2D metrology options are integrated with CIMS AOI systems becoming a part of inspection cycle, eliminating the need for a separate process.

CIMS offers two types of 2D metrology:

+2CD: real time micro-measurements of individual PCB elements, such as traces or pads, with up to ±3 micron accuracy (subject to surface condition). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+2DM: AOI integrated macro-measurements of an entire panel in order to determine any dimensions violation. This option is used to automatically calculate stretch factor by measuring distances between targets in each corner of a panel. The measurement can be taken manually or automatically after each scan.

Highlights

• Integration with CIMS AOI systems
• Eliminates external measurement process
• Fast and reliable
• Provides immediate feedback and live alerts
• Data collection and output option
• Pre-programmed offline
• Automatic measurements of line’s top and bottom width

 Optional Features

• Each 2D option are supplied separate or as a bundle
• Can be bundled with 3D measurement capabilities
• CDB/CDBIC connectivity – defects classification and virtual defects mapping
• Data output options

All information subject to change without notice!

AOI for large panel inspection with min line/space down to 40 µm.

Phoenix LT, CIMS latest generation of AOI system, is designed for inspection of large panel of up to 914 mm x 1,067 mm( 36″ x 42″). It is capable to scan down to 40 µm line/space width technology.

The system’s state of the art optical technology Microlight™ is specifically designed and calibrated to achieve optimal image acquisition of laser drills both before and after plating as well as conformal mask applications. Optimized performance is achieved by combining superior image quality with customizable detection algorithms.

Equipped with the state-of-the-art image acquisition and advanced software capabilities, the Phoenix product family is renown for its exceptional detection achieved with lowest possible false calls rate.

Phoenix LT is powered by Spark™ – an innovative cross-platform detection engine.

Basic functionalities include

• Multi-Step and Multi-Zone for best detection policy set-up per zone
• Micro Inspection and metrology engine
• Fully automated set-up
• Variable continuous resolution defined automatically
• Cad Analyzer creates best reference for detection
• Dynamic Job enabling operators to instantly change:
  • resolution, steps, parameters on the AOI
• Filtering system – Inspection results can be re-processed on AOI / CVR and present defects immediately after filtering
• Full automatic (BLACK BOX) Data Processing and Preparation from CAM Station

 System highlights

• New linear motors for smooth & silent motion
• Robust structure
• Automated vacuum table
• Microlight illumination
• 64 bit based firmware
• Powerful processors to handle high density PCB
• Compatible with front or back L/U automation
• Simple and quick setting for new jobs

Optional Features

• Fi - Final inspection of finished bare boards
• +2DM metrology - panel dimensions measurement
• +2CD metrology - 2D measurments of circuit elements
• LDI - laser drill inspection
• CDB/CDBIC - defects classification and virtual defects mapping
• VVS - virtual verification system

All information subject to change without notice!

3D metrology is CIMS technology for accurate three dimensional measurements of individual elements of a PCB circuit. 3D metrology options can also be integrated with selected CIMS AOI systems providing a live control loop for the purposes of quality assurance.

CIMS offers two types of 3D metrology:

+3DH: real time 3D-measurements of a height or depth of individual PCB elements achieving up to ±2 micron accuracy (subject to surface condition of a measured element). The measurements can be taken manually or automatically in pre-defined locations such as coupons or individual circuit elements.

+3DP: real time 3D profiling of individual PCB elements with up to ±1 micron accuracy (subject to surface condition of a measured element). This option is commonly used for measuring depth of dimples resulting from plating over laser vias. +3DP allows users to detect quality problems related to a specific process and provide data necessary for corrective action.

Highlights

• Integration with CIMS AOI systems
• Eliminates external measurement process
• Fast and reliable
• Provides immediate feedback and live alerts
• Data collection and output option
• Pre-programmed offline

Optional Features

• Each 3D option are supplied separate or as a bundle
• Can be bundled with 2D measurement capabilities
• CDB/CDBIC connectivity – defects classification and virtual defects mapping
• Data output options

All information subject to change without notice!