Overview:
Planarizing of excess Resin/Paste after the Hole Filling Process is a critical process. Its succes depends on a variety of parameters:
- Type/Brand of Resin;
- Resin Bump Height;
- Resin Bump hardness;
- Copper thickness on the panel surface;
- Copper Surface flatness & variation;
- Prototype or volume production;
PCB manufacturers need to carefully consider these variations when chosing the type of Planarization system. It occurs regularly that PCB manufacturers use a combination of different systems for different variaties of filled via's.
