CIMS supplies the range of cost-effective solutions for this market that ensure fast and reliable inspection of all types of PCB materials and designs. Our systems can be used for inspection of bare copper, thick copper, photo-resist, finished boards as well as photo-tools such as silver halide artworks and glass masks.
Multi-layer PCB is the most common type of printed circuit boards produced with two or more layers of circuit patterns stacked vertically, each separated by an insulating medium. The connectivity between the layers is typically achieved by drilling through the laminated board and copper plating the drilled holes. MLB PCB are widely used in all types of consumer and industrial electronics. They can range in complexity from fairly simple to highly advanced boards such as those used in automotive and server applications.
HDI PCB are widely used in high end applications such as cellphones, tablets, computers and other devices that are typically characterized by space constraints. Moreover, production process of HDI PCB tends to be more complex compared to mainstream multi-layered boards (MLB). It also involves complex processes such as build-up and laser drill via which often require optical inspection of its own.
Flex & Rigid-Flex PCB (FPC) is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates. Flexible electronic assemblies may be manufactured using identical processes used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use. Rigid flex printed circuit boards use a combination of flexible and rigid board technologies in an application.
Our solutions for flex and rigid flex PCB inspection are based on advanced imaging technology developed for various types of HDI, IC Substrates and MLB. Since FPCs come in wide ranges of trace widths, CIMS offers a family of dedicated AOIs that can accommodate all this variety. In addition, we provide automated material handling solutions for roll-to-roll (R2R) types of FPC.
CIMS Galaxy AOI for MLB & HDI PCB inspection
Galaxy 10µm capable to scan down to 10 µm line/space width technology
Galaxy 15μm capable to scan down to 15 µm line/space width technology
Galaxy 25μm capable to scan down to 25 µm line/space width technology
available for all systems (Note: 3DH & 3DP not available for Galaxy 25)
Off-Line Verification and Repair stations:
VVR - Hybrid Verification & Repair Station
Ideal solution when Galaxy AOI is equipped with automatic Loader/Unloader;
VVR, CIMS hybrid-mode verification station that combines virtual and physical
verification within a single workstation. VVR for MLB is optimized for verification
matching to the AOI system line/space width technology.
AI-powered Hybrid Verification Systems
AIVR, CIMS AI-powered verification station that combines virtual and physical verification
within a single workstation. AIVR is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification to line/space technology matching the AOI.
