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CIMS Metrology and Add-On options

local measurement

2D Metrology ==>

 

 

 

2D & 3D Metrology options ==>

  • metrology testsingle and group measurements;
  • +2CD - automatic comprehensive reporting of 2D measurement locations;
  • +2DM - automatic comprehensive reporting of 2D panel dimensional measurement
  • +3DH - automatic comprehensive reporting of 3D copper height measurement
  • +3DP - automatic comprehensive reporting of 3D profiles (dimple inspection)

 

 

 

 Laser (micro) Via options ==>

  • laservia menuNon Plated Vias;
  • Plated Blind Vias;
  • Partial Coated Vias;


  • Through Hole Laser Vias;
  • Vias in extremel low contrast material;
  • Conformal Mask Vias.

 

 

 

final inspectionFinal Inspection option ==>

  • Add-On to any standard Galaxy AOI;
  • Detection of most common defects on copper, gold, silver surfaces;
  • Registration and damages to soldermask
  • Resist Slivers

 

 

 

Backdrilling options ==>

  • backdrill 1Detection of backdrilled holes;
  • Back-Drill Multi-Zone automatically generated in datapreparation;
  • Defect types: Missing, Partial remains, Shift, Over/Undersize &
    Island-, Protrusion-, Nick-, Open in Drill.