mSAP (Modified Semi Additive Process) supports ongoing development of manufacturing finer and more compact PCB product in order to enable higher-frequency signals through reliable fine feature (tracks) structures.
IC Substrate technology serves as a connector between IC chip and the PCB. It is, in effect, a highly miniaturized version of a printed circuit board itself. In other words, IC Substrates bridge the nano-scale world of a semiconductor device (IC) and the micron-scale of a PCB. Besides the mechanical support and protection for the chip, IC Substrates are also required for heat dissipation as well as signal and power distribution.
CIMS offers series of AOI and AVI solutions for manufacturers producing wide variety of IC Substrates. Our Galaxy AOI and Capricorn AVI systems are designed to inspect even the most advanced IC Substrate products with down to 4 micron line and space widths.
CIMS Galaxy AOI for IC-Substrate inspection (mSAP technology)
Galaxy Cx4µm capable to scan down to 4 µm line/space width technology
Galaxy Cx5µm capable to scan down to 5 µm line/space width technology
Galaxy Cx7μm capable to scan down to 7 µm line/space width technology
Galaxy Cx10μm capable to scan down to 10 µm line/space width technology
Galaxy Cx15μm capable to scan down to 15 µm line/space width technology
Off-Line Verification and Repair stations:
VVR - Hybrid Verification & Repair Station
Ideal solution when Galaxy AOI is equipped with automatic Loader/Unloader;
VVR, CIMS hybrid-mode verification station that combines virtual and physical
verification within a single workstation. VVR for MLB is optimized for verification
matching to the AOI system line/space width technology.
AI-powered Hybrid Verification Systems
AIVR, CIMS AI-powered verification station that combines virtual and physical verification
within a single workstation. AIVR is designed to support high volume manufacturing of HDI and multi-layer PCB and optimized for verification to line/space technology matching the AOI.
