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Mach3Lab GALAXY 700XB


The Galaxy 700 XB is a processing line that, in addition to performing the optimized drilling of the reference holes after processing the panel with X-rays,
eliminates the “flash” from the panel edges and rounds the corners, allowing good and safe handling for subsequent  processes.

AntaresXA 1536x852The Galaxy 700 XB is a fully automated processing line that includes an Antares module for the execution of the reference holes, followed by a module that performs the “flash” removal from the panel edges and the rounding of the four corners. Basically, the panel is delivered not only with the optimized tooling holes, but also with perfectly straight and beveled edges and corners, this allowing the efficient and safe manipulation of the panel during the subsequent processes. Other functionalities are available, such as the measurement of the panel thickness, the marking of the serial number and other data, and the removal of the burr around the “multiline” slots. The machine feeds itself by picking up the panels to be processed from the input cart and depositing the worked panels in a stack on the output cart.



ADVANTAGES:

  • High flexibility: Arbitrary number of Targets (min. 2) and holes;
  • Optimised hole drilling (geometrical error of the board is included into hole position calculation);
  • Fast cycle time;
  • Also useful for measuring panels only (measuring data can be easily exported);
  • Very userfriendly software;
  • Automatic unloading system of panels outside specification;
  • Full Automation Capability;

TWO SPINDLE VERSIONS:

PNEUMATIC:

  • 30.000 rpm fixed speed
  • Adjustable descending speed
  • Single tool
  • 16µm run-out
  • Simple & fast tool change                                                                                                                                                                                     

ELECTRIC: 

  • Max. 60.000rpm
  • Position and speed controlled Z-Axis
  • Automatic Tool Change (ATC)
  • 4 station tool magazine
  • Tool Length Device (TLD)
  • within 2µm run-out

PANEL FEATURES:

  • Max. dimensions: 580 X 660mm
  • Min: dimensions:  320 x 320mm
  • Panelthickness: 0.3 to 4mm
    (down to 0.1mm with special vacuum table - optional)
  • Target shape: round
  • Hole diameter: 1-4mm
  • Max hole count: unlimited

MACHINE FEATURES X-RAY:

  • Measuring accuracy: ±15µm
    (within a vision area of 640x480mm 25x19")
  • Drill on Target accuracy: ±15µm
    (round target)
  • Optimised drilling accuracy: ±18µm 
    (round targets @ Dt=600mm & Dh=DT 5mm)
  • Cycle time: 20 seconds
    (4 targets + 3 holes)
  • Productivity: 3 panels/minute
    (4 targets + 3 holes)

MACHINE FEATURES BEVELLING/CHAMFERING:

  • Chamfering diameter: 0.2 – 0,5”
  • Panel thickness: 0,02” – 0,2”
  • Max flash width: Over the beveling limits
  • Max flash thickness: ≤ panel thickness
  • Beveling tolerance: ± 0.02 mm                 
  • Process time: 60 sec.
    (Beveling + Chamfering + Automatic panel lay down)