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Reel2Reel

R2R Plasma

  • R2RBoffotto is proud to hold the largest global market share with its R2R Plasma. While requiring relatively low equipment maintenance costs, the product's excellent process   control system ensures stable processing of flexible circuit boards as thin as 20 μm and improves the quality of flexible circuit board holes. This roll-to-roll plasma system can process not only flexible circuit boards but also other flexible materials. It can also be used for the activation process before surface coating;

  • Compared with other similar products in the market,Boffotto's patented deviation correction control system features extremely long service life, stable winding quality, and minimized damage in the winding process.



Applications:

  • Cleaning of drill dirt in via holes and surfaces of flexible printed circuits;
  • Surface roughening and cleaning of web PI;
  • Surface roughening and cleaning of web Coverlay;
  • Surface cleaning of web electronic materials;
  • Surface cleaning of other web materials.

Machine Features:

  • Efficient cleaning of drill dirt in via holes;
  • Double floating electrode ensuring the uniformity of the double-sided processing;
  • Constant tension and constant speed control;
  • Separately isolated plasma reaction zone ensuring zero plasma interference with other mechanisms;
  • Patented plasma processing system;;
  • Patented deviation-correcting and web winding design.

Roll-to-roll microwave plasma treatment system:

  • R2R MWMicrowave plasmas have significant advantages over radio-frequency plasmas in handling electrostatic sensitive components;
  • As the electric field of microwave plasma oscillates at higher frequencies, the electrons travel a shorter distance before changing direction compared with those in RF plasma;
  • This means fewer electrons can reach the surface of the component during each cycle of motion,thus minimizing the effect of surface charges;
  • Due to the lowest surface charge, ions will not be accelerated to the surface, and thus undesired surface collisions is avoided.







The processing rate of the microwave roll-to-roll plasma processing system is twice that of the traditional plasma equipment, with a processing uniformity higher than 90%