The vacuum lamination process ensures a complete elimination of air from the surfaces of a printed circuit board, as well as perfect encapsulation of the traces. The machine has been developed for simultaneous application on both sides of the PCBs (flexible and rigid) in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask and ConforMASK dielectric film, copper foil for SBU technology and coverlayer application. The machine ensures a perfect adhesion of the dry film and that there are no air bubbles. The unit employs heat, vacuum and high pressure lamination and is suitable for in-line or stand-alone mode operation. The machine is provided with a data management system to supervise and control the process parameters via an appropriate software.
Advantages:
- Suitable for innerlayer or rigid panels-thickness range from 0,1 ÷ 3,2 mm.
- Clamps system on the exit conveyor for panel extraction.
- High lamination pressure adjustable up to 7Kg.
- Dynamic and static slap down cycles for better quality laminination.
- State-of-the-art vacuum technology
- Max. lamination temperature 180°C (356°F) – platen controlled by double zone for better temperature uniformity
- Completely controlled by OMRON PLC-operator interface in local language.
- Output panel temperature detection (only with silicone conveyor).
- The system can be either equipped with Silicone rubber conveyor or Upper/Lower RTR PET carrier system.
- Upper plate opening by servo motor cylinder.
- Over 100 recipes can be managed.
- Equipped with brushless servo-motor
- Statistic Process Control (SPC) – Easy data system proprietary software provided *
* Local and remote supervision, management and monitoring data by PC, auto–tuning for panel exit temperature, management of maintenance operations; automatic set-up of working parameters.
