The Modular Vacuum Press MVP24 series 1 is a modular line that can operate in line with a Roll to Roll system conveyor.
It is designed and built to eliminate trapped air bubbles from the surfaces and provide perfect encapsulation of the traces and a flatness surface of a printed circuit board, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, and Semiconductors.
The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good flatness surface and adhesion.
A combination of heat, vacuum, pressure, and flatness processes are utilized in the lamination cycle.
The machine has a data management system to control and record the process parameters using the latest technology of software & hardware
Advantages:
- Stainless steel construction suitable for clean room operation
- Dynamic and static slap down pressure
- State-of-the-art vacuum technology
- Standalone box for vacuum pump and oil press pump
- Vacuum heating plates controlled by double zone for fine temperature accuracy
- Flat Press heating plates with multiple thermocouples for fine temperature accuracy
- Flat Press plates pressure adjustable by ramp
- Cleaning modules with extractable adhesive rolls (option)
- Comfortable access to the working modules for cleaning or maintenance operations
- Flat Press with cooling system (option)
- Refrigerator plate for exit panels (option)
- HEPA filters available for both modules (option)
