The Vacuum Applicator model VA 7124 HP3 is a stand-alone unit, designed and built to ensure complete elimination of air from the surfaces, as well as perfect encapsulation of the traces.
This unit can be used for the lamination in printed circuit board, IC substrate, semiconductors, wafer cells industries. It has been developed for the simultaneous application on both sides and it can achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder mask or ConforMASK, dielectric film, cover layer application.
The machine ensures a perfect adhesion of the products and that there are no air bubbles by employing heat, vacuum and Hight lamination pressure.
The tool employs heat, vacuum and high lamination pressure.
The machine can be provided with a data management system to supervise and control all process parameters via an appropriate software and it is pre-set for barcode reader.
Advantages:
- Stainless steel construction-suitable for clean room operation
- Dynamic and Static high lamination pressure
- Max high lamination pressure adjustable
State-of-the-art vacuum technology- OMRON PLC – operator interface in various languages by touch screen display 7”
- Maximum lamination temperature 150°C (302°F)-platens’ temperature is individually controlled
- Comfortable access to the vacuum chamber for cleaning or maintenance operation
- High temperature RTR release film kit (option)
- Upper plate opening by motor
- Oil-free high lamination pressure
