Single Sided Vacuum Filling of (via) Holes
Main application: This machine is designed to fill holes in printed circuit boards with conductive or non conductive pastes;- The hole filling can be applied in Via Holes and in Blind Holes. The VHF-300V is also ideal for Selective Hole Filling applications.
The Filling Process:
- Once the printed circuit board in vertical position the door is closed and the vacuum process started;
- Door is closed and the chamber is made vacuous (about 20 sec.);
- The filling process starts with the paste by piston being pressed out of a cartridge into the bores by compressed air and the squeegee moved all over the PCB panel;
- The contact pressure, filling pressure and squeegee speed are fully adjustable;
- The movements of the X- and Y-axis are controlled by servo motors
Unique and unrivalled Filling Head Design! - The Inside holds the answer for the perfect pressure through each Nozzle!
Very accurate machined Filling Heads enabling perfect Fit for Seals!
Specifications:
- Maximum Panel size: 610 x 762mm
- Panel thickness: 0,15 – 8mm
- Plant depth: 1470mm
- Plant width: 1525mm
- Plant height: 1420mm
- Weight: approx. 720kg
Advantages:
- One Step process
- No risk of air bubbles inside the holes
- The paste is stored in a changeable cartridge
- Different head´s for different panel sizes
- All process parameters are part of the recipe
- The touch panel display allows up to 50 recipes to be stored
