MASS VCP-5000
The world's favorite choice for Double Sided Vacuum Filling of (via) Holes
This machine is designed for filling holes in printed circuit boards with conductive or non-conductive paste;
- Both through-holes and blind via-holes can be filled;
- Blind via-holes allow to be plugged double-sided in one cycle;
New in 2025!
Due to the many years if experience, both Mass and Adeon have introduced new developements;
- Strongly reduced Paste consumption due to new design Filling Heads and Set-up;
- Programmable filling distance;
- Integrated excess paste exhaust channel with special valves;
- Double capacity Vacuum Pump (option) for higher speed filling;
- New integrated Fume Exhaust system;
- Unlimited Recipe storage;
- Logging and Traceability Software - Industry 4.0, 5.0 and Smart Manufacturing compatible;
- Scavenger Unit can be ordered for left-, or righthand side;
- Different Sizes of VCP Systems added;
- Model VCP-5000 - Filling Area size: 660x762mm (24x30");
- Model VCP-5100 - Filling Area size: 660x914mm (24x36");
- Model VCP-3040 - Filling Area size: 762x1.016mm (30x40") - sliding doors horizontal;
- Model VCP-3050 - Filling Area size: 762x1.270mm (30x50") - sliding doors horizontal;
Due to its unique design with all components perfectly aligned for achieving fast vacuum and therefore maintaining the paste temperature at optimal process condition.
The Filling Process:
Once the printed circuit board in vertical position has been hanged upon pins, the door is closed and the vacuum process started;
- The vacuum has built up after about 15 seconds;
- The filling process begins with the paste by piston being pressed out of a cartridge supported by hydraulic cylinder force into the holes whilst the squeegee being moved over the printed circuit board;
- Both the kiss pressure of the filling heads to the printed circuit board and filling pressure are fully adjustable;
- The vertical motion is realized by an adjustable servomotor;
- The door is fitted with a safety light curtain;
- The paste is kept in refillable cartridges;
- Subject to the printed circuit format, different squeegee sizes are available;
- The machine is already designed for a large container system (LCS). The storage tank with paste is located outside the machine. A high-pressure valve for exact dosing is within the machine.
Unique and unrivalled Filling Head Design! - The Inside holds the answer for the perfect pressure through each Nozzle!
Very accurate machined Filling Heads enabling perfect Fit for Seals!
ES Automatic Scavenger System:
- This machine is designed for removing excess plugging paste from the surface of the printed circuit board;
- For doing so, the plugged panel is placed into the Automatic Scavenger System after which the automatic process of squeegee blades wiping off the excess paste material on both sides of the panel is conducted;
- Depending on the chosen Squeegee Blade pressure the excess Paste will be typically reduced by 20 to 6 micron (0.8 to 2.0 mil);
Baking and Planarizing:
- After the recommended Final Bake in an oven (time, temperature depending on Resing, brand & type), the filled panels can be planarised.
