Productivity:
8 test head system with linear drive technology
Stability:
High resolution cameras 3 µm / Px.
Flexibility:
Supports supstrate like PCB (SLP) applications
Description
The A9 Plus is utilizing the same technology as the A9 and is in addition equipped with a temperature control unit and 4 high-resolution cameras. The system provides the accuracy to test reliably pad sizes down to 25 microns and is optimized for the test of Substrate-like-PCBs and similar products.
Key benefits
A9 technology with additional temperature control and high resolution cameras for maximum accuracy;
Camera resolution of 3 micron per pixel compared to 6 micron of the standard A9.
Specifications
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8 test heads |
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Linear motor drives for X-, phi- and Z-axis |
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Granit base |
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High-resolution cameras with 3 microns per pixel |
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Max. test area |
610 mm x 510 mm (24" x 20") |
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Max. product size |
640 mm x 535 mm (25.2" x 21.0") |
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Test speed |
up to 220 TP/sec (depending on test method) |
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4 high-resolution color XGA-cameras |
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Smallest pad/pitch A9 |
25 µm*(1 mil) / 50 µm (2 mil) (* glass calibration) |
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Soft touch contacting |
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Micro short detection (MSD®) |
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Pneumatic clamping / tension frame |
Options: Embedded component test, Test floor integration with Universal Grid systems High-speed Kelvin 4-wire test up to 300 mA*, LaTest® (Latent defect)
